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MIL MIL-STD-1310H

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Shipboard Bonding, Grounding, and other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety

Description

MIL MIL-STD-1310H – Shipboard Bonding, Grounding, and other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety

This document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bonding, and intermodulation interference (IMI) requirements of MIL-STD-464.

Product Details

Published:
09/17/2009
Number of Pages:
46
File Size:
1 file , 530 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus

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Published by Publication Date Number of Pages
MIL 09/17/2009 46