JEDEC JESD51-14

Description

JEDEC JESD51-14 – INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH

This document specifies a test method (referred to herein as “Transient Dual Interface Measurement”) to determine the conductive thermal resistance “Junction-to-Case” R0JC (0JC) of semiconductor devices with a heat flow through a single path, i.e., semiconductor devices with a high conductive heat flow path from the die surface that is heated to a package case surface that can be cooled by contacting it to an external heat sink.

Product Details

Published:

11/01/2010

File Size:

1 file , 670 KB

Note:

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