Description
ASTM F3166 – Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization
1.1 This specification details the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.
Product Details
- Published:
- 05/01/2016
- Number of Pages:
- 5
- File Size:
- 1 file , 110 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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