JEDEC JESD51

Description

JEDEC JESD51 – METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)

This standard and its subsequent addendum’s, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of junction temperature for specific conditions. The data can be used for package design evaluation, device characterization and reliability predictions.

Product Details

Published:

12/01/1995

Number of Pages:

9

File Size:

1 file , 150 KB

Note:

This product is unavailable in Russia, Ukraine, Belarus