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JEDEC JESD59

JEDEC JESD59

Original price was: $88.40.Current price is: $34.00.

BOND WIRE MODELING STANDARD

Published by Publication Date Number of Pages
JEDEC 06/01/1997 16

Description

JEDEC JESD59 – BOND WIRE MODELING STANDARD

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

Product Details

Published:
06/01/1997
Number of Pages:
16
File Size:
1 file , 260 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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